ceramic substrates
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Metallized Ceramic Substrates
1.Thickness: 0.1㎜~1.5㎜ / 4mil~60mil 2.Cutting Accuracy: ±50㎛
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Multilayer Ceramic Substrates
1. Bulk density: 3.30 g/㎤ 2. Bending strength: >350 MPa
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Ceramic Substrates
Applications: LED packages, Power modules, FAX substrates for thermal printer head.
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